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    电阻发热元件温度均匀性仿真研究

    Simulation on Temperature Uniformity of Resistance Heating Elements

    • 摘要: 针对电阻发热元件普遍存在加热温度分布不均匀的问题,本文采用电热耦合仿真方法对发热元件的结构和材料进行研究与优化,以降低不同区域的温度差值。首先,采用温度均匀系数作为发热元件温度均匀性的量化指标,研究发热元件的折弯间隙宽度、内倒角和外倒角等折弯结构参数对温度分布均匀性的影响,在原发热元件基础上优化设计了一种能实现最佳温度均匀性的发热元件结构,其主要采用R1=0.3 mm的内倒圆与外直角结合的折弯结构,间隙宽度为0.5 mm。进一步研究了不同PTC(Positive Temperature Coefficient)材料对温度分布均匀性的影响,结果表明具有较高电阻率和较高热导率的铝铜合金材料有助于改善发热元件的温度均匀性。

       

      Abstract: Regarding the common issue of uneven temperature distribution in resistive heating elements, this paper adopts an electro-thermal coupling simulation method to research and optimize the structure and materials of the heating elements, aiming to reduce the temperature difference across different regions. Firstly, the temperature uniformity coefficient is used as a quantitative index to evaluate the temperature uniformity of heating elements. The influence of bending structure parameters such as the bending gap width, inner chamfer, and outer chamfer of the heating element on the uniformity of temperature distribution is studied. Based on the original heating element, an optimized heating element structure that can achieve the best temperature uniformity is designed, it mainly adopts a bending structure combining an inner fillet with R1 = 0.3 mm and an outer right angle, with a gap width of 0.5 mm. Furthermore, the influence of different PTC (Positive Temperature Coefficient) materials on the uniformity of temperature distribution is studied. The results show that the aluminum-copper alloy material with higher resistivity and higher thermal conductivity is beneficial to improving the temperature uniformity of the heating element.

       

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