高级检索

    电阻发热元件温度均匀性仿真研究

    Simulation on Temperature Uniformity of Resistance Heating Elements

    • 摘要: 针对电阻发热元件普遍存在加热温度分布不均匀的问题,本文采用电热耦合仿真方法对发热元件的结构和材料进行研究与优化,以降低不同区域的温度差值。首先,采用温度均匀系数作为发热元件温度均匀性的量化指标,研究发热元件的折弯间隙宽度、内倒角和外倒角等折弯结构参数对温度分布均匀性的影响,在原发热元件基础上优化设计了一种能实现最佳温度均匀性的发热元件结构,其主要采用R1=0.3 mm的内倒圆与外直角结合的折弯结构,间隙宽度为0.5 mm。进一步研究了不同PTC(Positive Temperature Coefficient)材料对温度分布均匀性的影响,结果表明具有较高电阻率和较高热导率的铝铜合金材料有助于改善发热元件的温度均匀性。

       

      Abstract: Aiming at the prevalent problem of uneven heating temperature distribution of resistance heating elements, the electro-thermal coupling simulation method was employed to study and optimize the structure and materials of heating elements in order to reduce the temperature difference in varied areas. The temperature uniformity coefficient was adopted as a quantitative index for the temperature uniformity of the heating element. Firstly, the influence of the bending structure parameters, such as the bending gap width, inner chamfer and outer chamfer of the heating elements, on the uniformity of temperature distribution were investigated. As a result, on the basis of the original heating element, an optimized design of a heating element structure that can achieve the best temperature uniformity is accomplished. This structure mainly adopts a bending configuration that combines an inner fillet with a radius of R1= 0.3 mm and an outer right angle, with a gap width of 0.5 mm. Eventually, the effect of different PTC materials on the temperature uniformity is further investigated, including aluminum-copper alloy, copper-nickel alloy, nickel-chromium alloy. It was found that the aluminum-copper alloy material with higher resistivity and higher thermal conductivity helps to improve the temperature uniformity of the heating elements. Especially under relatively high voltages (ranging from 3.0 V to 4.5 V), the aluminum-copper alloy exhibits good temperature uniformity, which has certain reference significance for practical design and application.

       

    /

    返回文章
    返回