Fang Xiao 1), Song Yuanwei 2) and Zhao Bin 1)* 1). Study on Electroless Copper and Nickel Plating[J]. Journal of East China University of Science and Technology, 1998, (1): 112-115.
Citation:
Fang Xiao 1), Song Yuanwei 2) and Zhao Bin 1)* 1). Study on Electroless Copper and Nickel Plating[J]. Journal of East China University of Science and Technology, 1998, (1): 112-115.
Fang Xiao 1), Song Yuanwei 2) and Zhao Bin 1)* 1). Study on Electroless Copper and Nickel Plating[J]. Journal of East China University of Science and Technology, 1998, (1): 112-115.
Citation:
Fang Xiao 1), Song Yuanwei 2) and Zhao Bin 1)* 1). Study on Electroless Copper and Nickel Plating[J]. Journal of East China University of Science and Technology, 1998, (1): 112-115.
This work optimized the recipe of alkaline electroless copper plating with formaldehyde(37%) as reducing agent and EDTA as complexing agent by addition of Ni 2+ , surface embellishing nickel plating and layer compounding material of nickel and copper. It was showed that all three means raised the anti wear property of the film to varying degrees.
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