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    邓键, 邓诗峰, 尤欣桐, 周小艺. 新型耐高温含硅芳炔树脂化学流变行为[J]. 华东理工大学学报(自然科学版), 2020, 46(1): 24-28. DOI: 10.14135/j.cnki.1006-3080.20181214001
    引用本文: 邓键, 邓诗峰, 尤欣桐, 周小艺. 新型耐高温含硅芳炔树脂化学流变行为[J]. 华东理工大学学报(自然科学版), 2020, 46(1): 24-28. DOI: 10.14135/j.cnki.1006-3080.20181214001
    DENG Jian, DENG Shifeng, YOU Xintong, ZHOU Xiaoyi. Chemical Rheological Behavior of New High Temperature Resistant Silicon-Containing Arylethyleneacetylene Resin[J]. Journal of East China University of Science and Technology, 2020, 46(1): 24-28. DOI: 10.14135/j.cnki.1006-3080.20181214001
    Citation: DENG Jian, DENG Shifeng, YOU Xintong, ZHOU Xiaoyi. Chemical Rheological Behavior of New High Temperature Resistant Silicon-Containing Arylethyleneacetylene Resin[J]. Journal of East China University of Science and Technology, 2020, 46(1): 24-28. DOI: 10.14135/j.cnki.1006-3080.20181214001

    新型耐高温含硅芳炔树脂化学流变行为

    Chemical Rheological Behavior of New High Temperature Resistant Silicon-Containing Arylethyleneacetylene Resin

    • 摘要: 锌粉催化合成的新型含硅芳炔树脂(PSEA)具有优良的耐热性能、介电性能以及优异的加工性能,适用于树脂传递模塑(RTM)成型工艺。对该树脂的化学流变行为进行了研究,并用平板小刀法研究树脂凝胶时间(tgel)与温度的关系,建立凝胶方程模型;用旋转黏度计和平板流变仪研究树脂流变特性与温度的关系,根据黏度-时间-温度的关系构建Dual-Arrhenius黏度方程模型,可为RTM成型工艺制备复合材料提供指导。

       

      Abstract: Zinc powder catalyzed synthesis of silicon-containing arylethyleneacetylene resin (PSEA) is liquid at room temperature, showing excellent heat resistance property, glorious dielectric property, as well as outstanding processing performance, which is thus widely used in the field of aeronautics & astronautics. Resin transfer molding (RTM) is a material processing method which could let the flow of low viscosity (less than 500 mPa·s) resin impregnate reinforcement material, and make it be cured and formed in a closed cavity. RTM process is extensively used in the aerospace and automotive industries due to the low porosity, good mechanical properties, high dimensional stability advantages of the resulting products. Such a RTM process is applicable to PSEA resin in this work, the chemical rheological behavior of PSEA resin was investigated. The relationship between gelation time (tgel) and the corresponding temperature was studied by small plate knife within the temperature range of 423—463 K during the gelation and curing. Furthermore, the gelation equation model was established, and the model theoretical results were in good consistent with the experimental data. The relationship between rheological characteristics and temperature of PSEA resin was investigated by rotating viscometer and plate rheometer. The experimental results show that the resin has a long low viscosity retention period within the temperature range of 373—403 K, and retention time is longer than 4 h, which make the resin easy to process and meet the requirements of the RTM process. On the basis of the relationship among resin viscosity, time and temperature, the dual-Arrhenius viscosity equation model was established, and the theoretical results of the equation model were in good agreement with the experimental data, providing scientific theoretical fundamentals for the preparation of composite materials by resin RTM molding.

       

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