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    方晓, 宋元伟. 铜镍复合化学镀[J]. 华东理工大学学报(自然科学版), 1998, (1): 112-115.
    引用本文: 方晓, 宋元伟. 铜镍复合化学镀[J]. 华东理工大学学报(自然科学版), 1998, (1): 112-115.
    Fang Xiao 1), Song Yuanwei 2) and Zhao Bin 1)* 1). Study on Electroless Copper and Nickel Plating[J]. Journal of East China University of Science and Technology, 1998, (1): 112-115.
    Citation: Fang Xiao 1), Song Yuanwei 2) and Zhao Bin 1)* 1). Study on Electroless Copper and Nickel Plating[J]. Journal of East China University of Science and Technology, 1998, (1): 112-115.

    铜镍复合化学镀

    Study on Electroless Copper and Nickel Plating

    • 摘要: 以甲醛为还原剂,EDTA为配位剂的碱性化学镀铜液中用添加Ni^2+,表面点缀镍和层状复合化学镀(镀镍、镀铜)三种方法优化了化学镀铜工艺条件,提高了不锈钢基化学镀铜层的性能。结果表明,几种方法都在不同程度上改善了不锈钢基化学镀铜层的耐磨损性能,添加Ni^2+与层状复合镀相结合的效果最好,镀层的耐磨损性能比一般化学镀铜层提高35%左右。

       

      Abstract: This work optimized the recipe of alkaline electroless copper plating with formaldehyde(37%) as reducing agent and EDTA as complexing agent by addition of Ni 2+ , surface embellishing nickel plating and layer compounding material of nickel and copper. It was showed that all three means raised the anti wear property of the film to varying degrees.

       

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