SiO2化学机械抛光浆料的制备与性能研究

王相田, 刘伟. SiO2化学机械抛光浆料的制备与性能研究[J]. 华东理工大学学报（自然科学版）, 1998, (6): 681-685.

引用本文:

王相田, 刘伟. SiO2化学机械抛光浆料的制备与性能研究[J]. 华东理工大学学报（自然科学版）, 1998, (6): 681-685.

Preparation of SiO 2 CMP Slurry and Its Properties[J]. Journal of East China University of Science and Technology, 1998, (6): 681-685.

Citation:

Preparation of SiO 2 CMP Slurry and Its Properties[J]. Journal of East China University of Science and Technology, 1998, (6): 681-685.

Preparation of SiO 2 CMP Slurry and Its Properties

摘要: 研究了ＳｉＯ２化学机械抛光（ＣＭＰ）浆料制备过程中水溶液ｐＨ值，分散时间，搅拌转速，母液浓度，分散工艺等因素对制备及浆料性能的影响，讨论了母液法，直接法分散机理。

Abstract: It was studied that the aqueous solution's pH, the disperse time, the agitation rate, the raw slurry's concentration, the disperse process, et al. affect the preparation of silica slurry for chemical mechanical polishing and the properties of the obtained slurry. The mechanics of the direct method and the indirect method process were discussed.

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