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    陈元俊, 郭康康, 王帆, 朱亚平, 齐会民. 含氟硅芳炔树脂的合成与性能研究[J]. 华东理工大学学报(自然科学版), 2020, 46(3): 368-375. DOI: 10.14135/j.cnki.1006-3080.20190225005
    引用本文: 陈元俊, 郭康康, 王帆, 朱亚平, 齐会民. 含氟硅芳炔树脂的合成与性能研究[J]. 华东理工大学学报(自然科学版), 2020, 46(3): 368-375. DOI: 10.14135/j.cnki.1006-3080.20190225005
    CHEN Yuanjun, GUO Kangkang, WANG Fan, ZHU Yaping, QI Huimin. Synthesis and Performance of Fluorine-Containing Silicon Arylacetylene Resins[J]. Journal of East China University of Science and Technology, 2020, 46(3): 368-375. DOI: 10.14135/j.cnki.1006-3080.20190225005
    Citation: CHEN Yuanjun, GUO Kangkang, WANG Fan, ZHU Yaping, QI Huimin. Synthesis and Performance of Fluorine-Containing Silicon Arylacetylene Resins[J]. Journal of East China University of Science and Technology, 2020, 46(3): 368-375. DOI: 10.14135/j.cnki.1006-3080.20190225005

    含氟硅芳炔树脂的合成与性能研究

    Synthesis and Performance of Fluorine-Containing Silicon Arylacetylene Resins

    • 摘要: 通过长链含氟烷基三氯硅烷和二乙炔基苯格氏试剂的缩合反应合成了耐高温低介电的含氟硅芳炔树脂(PSAFs),该树脂在室温下为黏稠液体。通过平板流变仪研究了树脂的流变性能,采用差示扫描量热法研究了树脂的固化行为,采用热失重分析和介电仪研究了树脂的耐热性能、介电性能等。结果表明:PSAFs具有良好的工艺性能,其加工窗口为40~150 ℃,固化温度为150~300 ℃;氟元素的引入改善了含硅芳炔树脂浇铸体的介电性能,在频率为1 MHz下,介电常数为2.43~2.62,介电损耗为0.003 0~0.005 8;同时随着氟含量增加,介电常数降低,而介电损耗变化不大;树脂固化物PSAF1和PSAF2在N2气氛下失重5%温度(Td5)分别为430、416 ℃,1 000 ℃的残留率分别为42.3%、34.7%,具有良好的热稳定性能。

       

      Abstract: Silicon-containing arylacetylene resin(PSA) has been widely used in aerospace and electronic information field, because of it’s excellent process performance, high temperature resistance and dielectric properties. However, the dielectric constant of PSA resin still cannot meet the use of the very large scale integration (VLSI). Fluorine-containing silicon arylacetylene resins(PSAFs), which offered high temperature resistance and low dielectric constant, were synthesized through the reaction between long chain fluoroalkyltrichlorosilane and phenyldiethynylmagnesium bromide, and their structures were characterized using FT-IR, 1H- NMR and 19F-NMR. The rheological properties and cure behavior of the PSAFs resins were investigated by the rotational rheometer and DSC. The thermal stability and dielectric properties of the cured PSAFs resins were analyzed by thermogravimetric analysis and dielectric spectrometer. The results showed that the PSAFs resins had good processability, and the processing window was under the temperature ranging from 40 ℃ to 150 ℃. The incorporation of fluorine into silicon-containing arylacetylene resin improved the dielectric properties, and the dielectric constants of the cured PSAFs resins can tuned from 2.43 to 2.62, and the dielectric loss were varied from 0.003 0 to 0.005 8 under 1 MHz, respectively. Moreover, the dielectric constant was decreased with the increase in fluorine content, but the dielectric loss did not change significantly. The 5% weight loss temperature of the cured PSAF1 and PSAF2 resins under nitrogen atmosphere were 430 ℃ and 416 ℃, and the decomposition residue at 1 000 ℃ were 42.3% and 34.7%, respectively.

       

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